THIXOTROPIC, HIGH IMPACT, FAST SETTING POTTING COMPOUND | ||||
PRODUCT: | L - l l - 49 | |||
DESCRIPTION: | L-ll-49 is a thixotropic, high impact, fast setting compound designed for back potting connectors where low flow is required. | |||
SPECIFICATION: | ||||
COLOR: | Black Thixotropic 1.07 3.0 - 4.2% 3 months @ -40 ° F | |||
PHYSICAL PROPERTIES: | (Typical values, not intended for use in preparing specifications) | |||
Tensile strength Flexural strength Hardness Shore D Elongation % Water absorption % 24 Hrs. @ 25 ° C | 10,000 psi. 12,000 psi. 85 2-3 0.15 - 0.25 | |||
ELECTRICAL PROPERTIES: | Dielectrical Constant | Power Factor | ||
60 cps 3.3-3.4 10 to the 6th cps 3.0-3.2 | 60 cps 0.01-0.02 10 to the 6th cps 0.01-0.02 | Dielectric strength 500Volts/mil | ||
CURING PROCEDURE: | 1. Clean thoroughly all surfaces to be bonded. | |||
Pot life: Viscosity Cure cycle: Premixed frozen: | 60 min Thixotropic 24 Hrs. @ RT or 1 Hr @ 150 ° F or 20 min @ 200 ° F Thaw to RT. apply and cure | |||
CURED PROPERTIES: | Appearance of material will appear matte to glossy. | |||
WASTE DISPOSAL: | Allow to cure 24 hrs @ RT. Material is now inert and may be disposed of in a normal landfill. |
HIGH THERMAL CONDUCTIVITY POTTING/ENCAPSULATION | |||||
PRODUCT: | CF-4306 | ||||
DESCRIPTION: | CF-4306 is an electronic encapsulation material combining excellent electrical properties with high thermal conductivity and low thermal expansion. | ||||
SPECIFICATION: | PART A | PART B | |||
COLOR: | Black 70,000 cps 2.3 12 months 100% | Clear | |||
PHYSICAL PROPERTIES: | (Typical values, not intended for use in preparing specifications) | ||||
Density Lb/cu.in Tensile strength Flexural strength Compressive strength Hardness Shore D Coef. Of thermal expansion Coef. Of thermal conductivity Linear shrinkagein/in Heat distortion temp. | .057 8,000 psi. 13,000 psi. 16,000 psi 90 30 x 10 to the -6 .83 BTU/Hr./Sq.Ft./Ft/ ° F .001 135 ° C | ||||
ELECTRICAL PROPERTIES: | @ 30° C | @ 150° C | |||
K | D | K | D | ||
100Hz. 100K Hz. Vol. resistivity Dielectric Strength -Volts/mil. | 6.0 | .008 .020 | 7.3 | .08 .02 | |
CURING PROCEDURE: | 1. Stir part A thoroughly, de-air if possible | ||||
Mix Ratio by weight: A/B | 100/3.5 | ||||
CURED PROPERTIES: | Appearance of material will appear matte to glossy. | ||||
WASTE DISPOSAL: | Allow to cure 24 hrs @ RT. Material is now inert and may be disposed of in a normal landfill. |
GENERAL PURPOSE, VARIABLE FLEXIBILITY, HIGH IMPACT STRENGTH ADHESIVE | |||
PRODUCT: | CF-3001 | ||
DESCRIPTION: | CF-3001 is an epoxy based, room temperature cure, variable flexibility adhesive. CF-3001 has excellent resistance to mechanical impact and shock, low shrink during cure, and good electrical properties. This adhesive is recommended for bonding many different materials, wood, aluminum, steel, glass, di-allyl, phenolic, etc. | ||
SPECIFICATION: | PART A | PART B | |
COLOR: VISCOSITY: Sp. Gravity: Shelf Life: | Amber 10-12,000 cps 1.16 12 months | Dark Amber 40-50,000 cps 0.95 12 months | |
PHYSICAL PROPERTIES: | (Typical values, not intended for use in preparing specifications) Tensile shear (Aluminum to Aluminum) | ||
-300° F -100° F RT +160° F +200° F Hardness Shore D @ 50/50 Coef. Of thermal expansion Thermal shock per Mil-I-16923 Mechanical shock per Mil-I-16923 | 2000 psi 2400 psi 3000 psi 600 psi 300 psi 90 4.4 x 10-5 in/in/ ° F Passes all cycles 227 in. lbs. | ||
CURING PROCEDURE: | 1. Clean thoroughly all surfaces to be bonded. | ||
Mix Ratio by weight: Part A/Part B Pot life: Viscosity: Cure cycle: | Hard 3/1 to Soft 1/3 60 min + 18,000 – 30,000 cps 24 hrs @ RT or 1 hr @ 150° F or 20 min @ 200° F | ||
CURED PROPERTIES: | Appearance of material will appear matte to glossy. | ||
WASTE DISPOSAL: | Allow to cure 24 hrs @ RT. Material is now inert and may be disposed of in a normal landfill. |
RAPID CURE TWO COMPONENT ADHESIVE | ||||
PRODUCT: | CF-3009 | |||
DESCRIPTION: | CF-3009 is a rapid room temperature curing epoxy adhesive. Designed for bonding a wide range of materials, CF-3009 has excellent resistance to mechanical impact and shock. | |||
SPECIFICATION: | PART A | PART B | ||
COLOR: | Clear 100% 12,000 cps 12 months | Red | ||
PHYSICAL PROPERTIES: | (Typical values, not intended for use in preparing specifications) Tensile shear | |||
Cured @ 75 ° F Hardness shore D Cured @ 75 ° F Cured @ RT 7 Days + 2 hr water boil Water absorption - Weight % 7 Days @ 75 ° F + 24 hrs in water | 30 minutes 2 hours 10 min 20 min 30 min 01 hour 24 hours 0.33 | 1,000 psi | ||
CURING PROCEDURE: | 1. Clean thoroughly all surfaces to be bonded. | |||
Mix Ratio: Part A / Part B | 50/50 | |||
CURED PROPERTIES: | Appearance of material will appear satin clear. | |||
WASTE DISPOSAL: | Any mixed material is inert after being cured for approx. 10 - 20 min. |
The information herein is based on data obtained by our own research and is considered accurate. However, no warranty is expressed or implied regarding the accuracy of these data, the results to be obtained from the use thereof, or that any such use will not infringe any patent. This information is furnished upon the condition that the person receiving it shall make his own tests to determine the suitability thereof for his particular purpose.
VERY LOW VISCOSITY, ENCAPSULATION/POTTING IMPREGNATING COMPOUND | ||||
PRODUCT: | CF-4300 | |||
DESCRIPTION: | CF-4300 is a very low viscosity, 100% solids epoxy encapsulation/potting resin. Of particular importance is CF-4300 ability to quickly wet out and impregnate all types of electronic coils, transformers, etc. Long pot life, medium temperature cure cycle, good mechanical and thermal impact strength, recommended as a general purpose electronic material. CF-4300 meets the requirements of MIL-I-16923. | |||
SPECIFICATION: | PART A | PART B | PART C | |
COLOR: | Light Amber 10 - 12,000 cps 1.15-1.17 12 months 100% | Amber | Dark Amber | |
PHYSICAL PROPERTIES: | (Typical values, not intended for use in preparing specifications) | |||
Density Lb/cu.in Tensile strength Flexural strength Compressive strength Hardness Shore D Coef. Of thermal expansion Linear shrinkage % Heat distortion temp. | .043 11,500 psi. 21,200 psi. 16,800 psi 89 35 x 10 to the -6 .5 250 ° C | |||
ELECTRICAL PROPERTIES: | K | D | ||
100Hz. @ 25 ° C 100K Hz. @ 25 ° C Dielectric Strength -Volts/mil. | 3.28 | .008 .014 475 | ||
CURING PROCEDURE: | 1. If either Part A or Part B is cloudy or crystallized, warm to 180–250 ° F until clear, Cool to room temperature. | |||
Mix Ratio by weight: A/B/C | 100/100/.5 | |||
CURED PROPERTIES: | ||||
WASTE DISPOSAL: | Allow to cure 2-4 Hrs. @ 250 ° F. Material is now inert and may be disposed of in a normal landfill. |
C.E. FREY ENGINEERING, LLC ©
Epoxy Formulators
MEDIUM VISCOSITY, FAST HEAT CURE , MEDIUM POT LIFE ADHESIVE | ||||
PRODUCT: | CF-3304 | |||
DESCRIPTION: | CF-3304 is a medium viscosity, medium pot life adhesive that cures quickly at elevated temperatures. CF-3304 has found wide use as an adhesive for neoprene rubber, glass filled nylon, Di-allyl, Phenolic, epoxy molded parts, and engineered plastic parts. The long working time and short elevated cure recommended the use of CF-3304 for automatic and semi-automatic application. | |||
SPECIFICATION: | PART A | PART B | ||
COLOR: | Amber 12,000 cps 1.16 12 months | Amber | ||
PHYSICAL PROPERTIES: | (Typical values, not intended for use in preparing specifications) Tensile shear (Aluminum to Aluminum) | |||
-65° F -75° F +190° F Hardness Shore D Coef. Of thermal expansion Thermal shock per Mil-I-16923 Mechanical shock per Mil-I-16923 | 2000 psi 2400 psi 1000 psi 90 4.4 x 10-5 in/in/ ° F Passes all cycles 175 in. lbs. | |||
CURING PROCEDURE: | 1. Clean thoroughly all surfaces to be bonded. | |||
Mix Ratio by weight: | 100/25 | |||
CURED PROPERTIES: | Appearance of material will appear matte to glossy. | |||
WASTE DISPOSAL: | Allow to cure 24 hrs @ RT. Material is now inert and may be disposed of in a normal landfill. |
FAST HEAT CURE, MEDIUM POT LIFE ADHESIVE/POTTING COMPOUND | |||
PRODUCT: | CF-3003-80 | ||
DESCRIPTION: | CF-3003-80 is a high viscosity, medium pot life adhesive that cures quickly at elevated temperatures. It has found wide use as an adhesive for neoprene rubber, glass filled nylon, di-allyl, phenolic, epoxy molded parts and many plated metals. The long working time and short elevated cure recommends its use for automatic and semi-automatic application. | ||
SPECIFICATION: | PART A | PART B | |
COLOR: VISCOSITY: Sp. Gravity: Shelf Life: Shelf Life - Premixed Frozen | Black 115-125,000 cps 1.85 12 months 3 months @ -40° F Part A and B mixed | Amber | |
PHYSICAL PROPERTIES: | (Typical values, not intended for use in preparing specifications) Tensile shear (Aluminum to Aluminum) | ||
-65° F +75° F +190° F Hardness Shore Thermal expansion Linear shrinkage Dielectric strength | 2000 psi 2400 psi 1000 psi D 85 Min in/in/per ° F 22x10 -6 .001 in/in/ °C 450 volts/mil | ||
CURING PROCEDURE: | 1. Clean thoroughly all surfaces to be bonded. | ||
Mix Ratio by weight: | 100 pts A with 12.4 pts B | ||
CURED PROPERTIES: | Appearance of material will appear matte to glossy. (with amber hue) Operating Temp. -40 ° F to 400 ° F | ||
WASTE DISPOSAL: | Allow to cure 24 hrs @ RT. Material is now inert and may be disposed of in a normal landfill. |
HIGH TEMPERATURE, LOW VISCOSITY, FLAME RETARDANT, POTTING/IMPREGNATING COMPOUND | ||||
PRODUCT: | CF-4324 | |||
DESCRIPTION: | CF-4324 is a low viscosity 100% solids resin system designed to impart flame retardant properties in coil forms and laminated sheet. CF-4324 has also found use as a potting and encapsulating compound. | |||
SPECIFICATION: | PART A | PART B | ||
COLOR: | Light Grey 12 - 14,000 cps 1.2 12 months 100% | Amber | ||
PHYSICAL PROPERTIES: | (Typical values, not intended for use in preparing specifications) | |||
Density Lb/cu.in Tensile strength Flexural strength Compressive strength Hardness Shore D Coef. Of thermal expansion Linear shrinkage % Heat distortion temp. | .050 12,100 psi. 18,500 psi. 20,000 psi 92 28 x 10 to the -6 .4 % 270 ° C | |||
ELECTRICAL PROPERTIES: | K | D | ||
100Hz. @ 25 ° C Dielectric Strength -Volts/mil. | 3.4 | .009 500 | ||
CURING PROCEDURE: | 1. If either Part A or Part B is cloudy or crystallized, warm to 180–250 ° F until clear, Cool to room temperature. | |||
Mix Ratio by weight: A/B/C | 100/100 | |||
CURED PROPERTIES: | Contains Antimony Trioxide | |||
WASTE DISPOSAL: | Contains Chlorendic Anhydride |
FAST HEAT CURE, MEDIUM POT LIFE ADHESIVE/POTTING COMPOUND | |||
PRODUCT: | CF-3003 NATURAL | ||
DESCRIPTION: | CF-3003 NATURAL is a thixotropic, medium pot life adhesive that cures quickly at elevated temperatures. It has found wide use as an adhesive for neoprene rubber, glass filled nylon, di-allyl, phenolic, epoxy molded parts and many plated metals. The long working time and short elevated cure recommends its use for automatic and semi-automatic application. | ||
SPECIFICATION: | PART A | PART B | |
COLOR: VISCOSITY: Sp. Gravity: Shelf Life: Shelf Life - Premixed Frozen | Brown Thixotropic 1.9 12 months 3 months @ -40° F Part A and B mixed | Amber | |
PHYSICAL PROPERTIES: | (Typical values, not intended for use in preparing specifications) Tensile shear (Aluminum to Aluminum) | ||
-65° F +75° F +190° F Hardness Shore Thermal expansion Linear shrinkage Dielectric strength Thermal conductivity (BTU)(in)/(hr)(ft2)(° F) | 2000 psi 2400 psi 1000 psi D 85 Min in/in/per ° F 22x10 -6 .001 in/in/ °C 450 volts/mil 4.6 | ||
CURING PROCEDURE: | 1. Clean thoroughly all surfaces to be bonded. | ||
Mix Ratio by weight: | 100 pts A with 11.5 pts B | ||
CURED PROPERTIES: | Appearance of material will appear matte to glossy. (with amber hue) Operating Temp. -40 ° F to 400 ° F | ||
WASTE DISPOSAL: | Allow to cure 24 hrs @ RT. Material is now inert and may be disposed of in a normal landfill. |
MEDIUM VISCOSITY, FAST ROOM TEMPERATURE CURE, POTTING/ENCAPSULATION | |||||
PRODUCT: | CF-4301 | ||||
DESCRIPTION: | CF-4301 is a 100% solids epoxy based potting compound. Designed to cure quickly at low temperatures. CF-4301 is recommended for encapsulating all types of electronic components. | ||||
SPECIFICATION: | PART A | PART B | |||
COLOR: | Black 80,000 cps 1.50-1.65 12 months 100% | Clear | |||
PHYSICAL PROPERTIES: | (Typical values, not intended for use in preparing specifications) | ||||
Density Lb/cu.in Tensile strength Flexural strength Compressive strength Hardness Shore D Coef. Of thermal expansion Linear shrinkage in/in Heat distortion temp. | .057 9,000 psi. 15,000 psi. 17,000 psi 92 28 x 10 to the -6 .006 100 ° C | ||||
ELECTRICAL PROPERTIES: | @ 30° C | @ 150° C | |||
K | D | K | D | ||
100Hz. 100K Hz. Vol. resistivity Dielectric Strength -Volts/mil. | 4.62 4.20 | .017 .031 | 5.97 | .158 .023 | |
CURING PROCEDURE: | 1. Stir part A thoroughly, de-air if possible | ||||
Mix Ratio by weight: A/B/C | 100/6 | ||||
CURED PROPERTIES: | Appearance of material will appear matte to glossy. | ||||
WASTE DISPOSAL: | Allow to cure 24 hrs @ RT. Material is now inert and may be disposed of in a normal landfill. |
MEDIUM VISCOSITY, ELEVATED TEMPERATURE CURE, POTTING/ENCAPSULATION | |||||
PRODUCT: | CF-4302 | ||||
DESCRIPTION: | CF-4302 is a 100% solids epoxy based potting compound. Designed for use at elevated temperatures. CF-4302 is recommended for encapsulating all types of electronic components. | ||||
SPECIFICATION: | PART A | PART B | |||
COLOR: | Black 80,000 cps 1.50-1.65 12 months 100% | Dark Amber | |||
PHYSICAL PROPERTIES: | (Typical values, not intended for use in preparing specifications) | ||||
Density Lb/cu.in Tensile strength Flexural strength Compressive strength Hardness Shore D Coef. Of thermal expansion Coef. Of thermal conductivity Linear shrinkage in/in | .057 10,000 psi. 15,000 psi. 27,000 psi 93 28 x 10 to the -6 .45BTU/HR/FTxFT/FT ° F .005 | ||||
ELECTRICAL PROPERTIES: | @ 30° C | @ 150° C | |||
K | D | K | D | ||
100Hz. 100K Hz. Vol. resistivity Dielectric Strength -Volts/mil. | 4.20 | .011 .021 | 4.50 | .055 .042 | |
CURING PROCEDURE: | 1. Stir part A thoroughly, de-air if possible | ||||
Mix Ratio by weight: A/B | 100/8 | ||||
CURED PROPERTIES: | Appearance of material will appear matte to glossy black. | ||||
WASTE DISPOSAL: | Allow to cure 4-5 Hrs. @ 180 ° F. Material is now inert and may be disposed of in a normal landfill. |